JPH0381306B2 - - Google Patents
Info
- Publication number
- JPH0381306B2 JPH0381306B2 JP3407686A JP3407686A JPH0381306B2 JP H0381306 B2 JPH0381306 B2 JP H0381306B2 JP 3407686 A JP3407686 A JP 3407686A JP 3407686 A JP3407686 A JP 3407686A JP H0381306 B2 JPH0381306 B2 JP H0381306B2
- Authority
- JP
- Japan
- Prior art keywords
- conveyor
- component
- side conveyor
- integrated circuit
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 description 26
- 238000005476 soldering Methods 0.000 description 15
- 230000003028 elevating effect Effects 0.000 description 10
- 238000004140 cleaning Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 230000036544 posture Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Molten Solder (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3407686A JPS62193160A (ja) | 1986-02-19 | 1986-02-19 | 自動はんだ付け装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3407686A JPS62193160A (ja) | 1986-02-19 | 1986-02-19 | 自動はんだ付け装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62193160A JPS62193160A (ja) | 1987-08-25 |
JPH0381306B2 true JPH0381306B2 (en]) | 1991-12-27 |
Family
ID=12404166
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3407686A Granted JPS62193160A (ja) | 1986-02-19 | 1986-02-19 | 自動はんだ付け装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62193160A (en]) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3123912A1 (fr) | 2021-06-15 | 2022-12-16 | Draka Comteq France | Procédé de fabrication d'une préforme pour une fibre optique multi-cœurs et procédé de fabrication de fibres optiques multi-cœurs. |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005031923A1 (de) * | 2005-07-07 | 2007-01-11 | Brain, Bernhard | Verfahren und Vorrichtung zum Beladen und Entladen von Elementen in ein Trägerelement |
-
1986
- 1986-02-19 JP JP3407686A patent/JPS62193160A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3123912A1 (fr) | 2021-06-15 | 2022-12-16 | Draka Comteq France | Procédé de fabrication d'une préforme pour une fibre optique multi-cœurs et procédé de fabrication de fibres optiques multi-cœurs. |
EP4105185A1 (en) | 2021-06-15 | 2022-12-21 | Draka Comteq France | Method for manufacturing a preform for a multi-core optical fiber and a multi-core optical fibers |
Also Published As
Publication number | Publication date |
---|---|
JPS62193160A (ja) | 1987-08-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4787550A (en) | Automatic soldering apparatus | |
US4654227A (en) | Method and apparatus for DIP tinning | |
JPH0381306B2 (en]) | ||
US4603804A (en) | Automatic soldering apparatus | |
EP0311393A2 (en) | Tinning system for axial and radial leaded components | |
CN216419974U (zh) | 一种自动点胶设备 | |
JPS62193161A (ja) | はんだ付け用移載装置 | |
JP3590894B2 (ja) | 自動半田付け方法及び自動半田付け装置 | |
CN217971450U (zh) | 一种具有缓存功能的fpc裸板清洗设备 | |
JPS6343195B2 (en]) | ||
JPH0329005Y2 (en]) | ||
JPS6227323Y2 (en]) | ||
JPS6027468A (ja) | 半田デイツプ装置 | |
JPH0225574Y2 (en]) | ||
CA1256323A (en) | Method and apparatus for dip tinning | |
JPH0442057Y2 (en]) | ||
JPS643577Y2 (en]) | ||
JPS61129276A (ja) | 自動はんだ付け装置 | |
JPS6331822Y2 (en]) | ||
JPS63317260A (ja) | 自動はんだ付け装置 | |
JPH0142633B2 (en]) | ||
JPH0557069B2 (en]) | ||
JPH0260153A (ja) | メッキ装置 | |
JPH0344869B2 (en]) | ||
JPS63317252A (ja) | 自動はんだ付け装置におけるワ−ク移載機構 |